Printed Circuit Board Assembly Service
For three consecutive years:
Best of 2014, 2015 and 2016
ACME PCB Assembly utilizes an Ersa IR/PL 650 XL for reworking large PCBs
Reworking large PCBs can be extremely difficult. But with the IR/PL 650 XL BGA rework machine, ACME PCB can now safely handle even the toughest requirements.
The IR/PL 650 XL BGA rework machine gives ACME PCB Assembly the flexibility to work on many projects including extra-large printed circuit boards (PCBs) up to 20″ x 24″ (500 mm x 625 mm).
The IR/PL 650 XLis Ersa’s flagship machine with one of the industry’s largest and most powerful bottom-side heaters – an 8,000 W medium wavelength IR heater measuring 500 mm x 625 mm.
The Ball Grid Array (BGA) is a SMT package that can have many hundreds of pins. It has become one of the most popular packages for high pin-counts because the entire bottom surface of the device can be used, instead of just the perimeter. BGA devices are not suitable for socket mounting and must be soldered. This requires precise, automated placement and heating. ACME PCB Assembly is capable of placing BGAs with either tin-lead, or lead-free (RoHS) solders.
Once installed, the BGAs must be inspected to establish the quality of solder joints. At ACME PCB Assembly, we utilize X-ray inspection followed by a state-of-the-art microscope inspection of solder joints of the BGA.