The Ball Grid Array (BGA) is a SMT package that can have many hundreds of pins. It has become one of the most popular packages for high pin-counts because the entire bottom surface of the device can be used, instead of just the perimeter. BGA devices are not suitable for socket mounting and must be soldered. This requires precise, automated placement and heating. ACME PCB Assembly is capable of placing BGAs with either tin-lead, or lead-free (RoHS) solders.
Once installed, the BGAs must be inspected to establish the quality of solder joints. At ACME PCB Assembly, we utilize X-ray inspection followed by a state-of-the-art microscope inspection of solder joints of the BGA.