ISO 14001:2015 Certification

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ACME PCB Assembly is proud of achieving the ENVIRONMENTAL MANAGEMENT SYSTEMS – ISO 14001:2015 certification. A great effort was made to accomplishing this.

ISO 14001:2015 specifies the requirements for an environmental management system that an organization can use to enhance its environmental performance. ISO 14001:2015 is intended for use by an organization seeking to manage its environmental responsibilities in a systematic manner that contributes to the environmental pillar of sustainability.  We worked very hard to achieve this.

Precision Wire Stripping at ACME PCB Assembly

Jacket Slitting

Does your project require wire-jacket slitting?  ACME PCB ASSEMBLY can slit the jackets of  wire diameters from o.1″ to 1.0″ (3-25 mm).  Slitting can be either radial, or radial and axial.   Wires can be out-of-round or twisted.

Watch how it’s done:

Stripping Cable Ends & Windows

Do you require wire stripping of cable ends or windows?   ACME PCB ASSEMBLY can strip wire sizes from 32 AWG to 2/0.

Watch how it’s done:

Stripping Multi-Conductor and Large Diamenter Wires

ACME PCB ASSEMBLY can strip multi-conductor cables and large diameter wires such as battery cables in  wire sizes from 32 AWG to 2/0.

Watch how it’s done:

Rotary Stripping Coaxial Cables

ACME PCB ASSEMBLY offers precision rotary stripping of coaxial cables and wires with outer diameters up to 0.43″ (11 mm) and stripping lengths up to 1.58″ (40 mm).

Watch how it’s done:

Reworking large PCBs

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ACME PCB Assembly utilizes an Ersa IR/PL 650 XL for reworking large PCBs

Reworking large PCBs can be extremely difficult. But with the IR/PL 650 XL BGA rework machine, ACME PCB can now safely handle even the toughest requirements.

The IR/PL 650 XL BGA rework machine gives ACME PCB Assembly the flexibility to work on many projects including extra-large printed circuit boards (PCBs) up to 20″ x 24″ (500 mm x 625 mm).

The IR/PL 650 XLis Ersa’s flagship machine with one of the industry’s largest and most powerful bottom-side heaters – an 8,000 W medium wavelength IR heater measuring 500 mm x 625 mm.

The Ball Grid Array (BGA)

BGA

The Ball Grid Array (BGA) is a SMT package that can have many hundreds of pins. It has become one of the most popular packages for high pin-counts because the entire bottom surface of the device can be used, instead of just the perimeter. BGA devices are not suitable for socket mounting and must be soldered. This requires precise, automated placement and heating. ACME PCB Assembly is capable of placing BGAs with either tin-lead, or lead-free (RoHS) solders.

Once installed, the BGAs must be inspected to establish the quality of solder joints.  At ACME PCB Assembly, we utilize X-ray inspection followed by a state-of-the-art microscope inspection of solder joints of the BGA.