A Ball Grid Array or (BGA) is a SMT (Surface Mount Technology) package that is most commonly used for Integrated Circuits (ICs) with a large number of pins. Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module.
With it being a high-density and low-cost packaging option, this technology helps create the best range of circuit boards with precision component placement and soldering excellence. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting. ACME PCB assembly has capabilities that include (ball grid array) BGA assembly and rework up to 65mm squared up to 36-layer printed circuit board.
BGA technology, which uses an array of solder balls for electrical interconnection, offers up several advantages over pin-grid array (PGA). A couple important advantages of this surface-mount package is:
Ball Grid Array enables assemble boards with reduced thickness. This is beneficial when it comes to making sleek electronic products like smart phone, and tablets.
They seldom require maintenance and repair.
The packaging is more stable because there are no pins that can be bent and broken.
Excellent improvement in both thermal and electrical performance, which efficiently uses the space of the circuit board.
BGA packaging is compatible with high-efficiency system products.
ACME Printed Circuit Board Assembly started it’s (Ball Grid Array) BGA assembly service in 1994. With so many years of experience in BGA assembly with X Ray inspection machine, and having the right assembly procedure in place, we are confident in saying that we can build a high quality, good yield rate BGA assembly board.
ACME Printed Circuit Board Assembly is an EMS located in Southern California near Los Angeles airport, it especially for Small to Medium run PCB assembly. Our workmanship meets IPC 610 standard. ISO 9001:2015 certified manufacturer for Electronics Contract manufacturing since Year 2000.
ACME PCB assembly also does BGA prototype assembly for our customers. We are able to create a BGA prototype assembly with or without stencil to help save our customer’s prototyping cost.
Please contact us 310-715-1898, or email us if you have any question.